Method of mounting fabrication-historical data for semiconductor device, and semiconductor device fabricated by such a method
US6598217B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2000 |
| Grant date | Jul 22, 2003 |
| Priority date | — |
| Expiry date | Aug 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of providing fabrication-historic data for a semiconductor device to a chip, has the step of: preparing a wafer with a pattern of a plurality of chips, where each chip has a product area to function as a semiconductor device and a fabrication-historical data area on which fabrication-historical data is to be held, wherein different fabrication-historical data is provided for each chip by exposing all of the chips on the wafer as a single unit by means of an exposure system using a mater mask while the product area of each chip is shielded from exposure or in one of the steps of forming the contact holes and carrying out wiring among the transistors. Consequently, the process can be easily performed because of the exposure in one operation using the master mask and thus the fabrication-historical data can be easily mounted on the chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.