Patent · US Expired

Diamond cutting tool

US6599178B1 · kind B1 · utility

27Cited by
8References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 27, 2000
Grant dateJul 29, 2003
Priority date
Expiry dateJul 27, 2020

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC23C16/56
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

A cutting tool with a synthetic diamond layer 2 having a cutting edge 5 is described, wherein the cutting edge 5 has a profile structured by etching of decreasing layer thickness. Furthermore, a process is described for producing such a cutting tool.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.