Diamond cutting tool
US6599178B1 · kind B1 · utility
27Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2000 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Jul 27, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/56
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting tool with a synthetic diamond layer 2 having a cutting edge 5 is described, wherein the cutting edge 5 has a profile structured by etching of decreasing layer thickness. Furthermore, a process is described for producing such a cutting tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.