Method for controlling flatness of wafer and manufacturing method of thin-film magnetic head
US6599435B2 · kind B2 · utility
0Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Jan 22, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3046
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A gas at an extremely low temperature is jet-sprayed onto a warped concave surface of a wafer to correct this warped concave surface flat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.