Pattern formation method and substrate manufacturing apparatus
US6599582B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 19, 1999 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Jan 19, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D86/0241
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a substrate manufacturing technique for forming patterns on substrates with the aid of an ink-jet systems. Relates to a substrate manufacturing apparatus for forming arbitrary patterns on a substrate 1 from a fluid 11. This apparatus comprises an ink-jet print head 2 configured to allow the fluid 11 to be ejected onto the substrate 1; treatment means 3 for performing a specific treatment on the substrate 1; drive means 4 configured to allow the relative positions of the ink-jet print head 2, the treatment means 3, and the substrate 1 to be varied; and control means 5 for controlling the ejection of the fluid 11 from the ink-jet print head 2, the treatment performed by the treatment means 3, and the drive effected by the drive means 4. The control means 5 is configured to allow the treatment by the treatment means to be performed prior to the ejection of fluid from the ink-jet print head 2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.