Patent · US Expired

Isolation testing scheme for multi-die packages

US6599764B1 · kind B1 · utility

8Cited by

3References

20Claims

0Family size

Assignee

Altera Corporation · US

Inventors

Boon Jin Ang · Butterworth, MY
Sammy Cheung · Pleasanton, US
Kar Keng Chua · Bukit Mertajam, MY

Key dates

Filing date	May 30, 2001
Grant date	Jul 29, 2003
Priority date	—
Expiry date	Jul 26, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2224/48145
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A test platform is configured to test a mult-die package having at a first die and a second die. The test platform includes a first lead that is connected to the VCC input on the first die. The test platform also includes a second lead that is connected to VCCIO input on the second die. The VCC input on the second die is connected to ground. The I/O pin of the second die can then be tri-stated using a control circuit disposed between the pre-driver and the driver of the I/O buffer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.