Surface mounting method for high power light emitting diode
US6599768B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 20, 2002 |
| Grant date | Jul 29, 2003 |
| Priority date | — |
| Expiry date | Aug 20, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a surface mounting method for high power output light emitting diode (LED). In the first preferred embodiment, the LED is mounted onto a thermal & electrical base-substrate, which has a plurality of trenches formed therein and filled with an insulating layer to isolate two parts of the base-substrate. A reflective frame assembler having a plurality of reflective frame is then adhered to the upper surface of the base-substrate. Each of them is for placing one LED chip. After a LED is with its two electrodes placed on a pair of the first metal contacts, the transparent resin or epoxy is refilled into reflective frame to seal the LED chip. In the second preferred embodiment, the LED is with two electrodes on the different side. Hence the LED is mounted on one metal contact only, the other electrode is in terms of a wire to bond to the other metal contact.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.