Void-free die attachment method with low melting metal
US6601753B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 17, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | May 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for attaching an electronic die to a substrate is disclosed. Preferably, the method includes depositing a pad of low temperature die attachment material within a die attachment area on the substrate, positioning the die over the pad of low temperature die attachment material, and compressing the die against the substrate to expel air trapped within the pad of low temperature die attachment material. Further, a bead of containment material is deposited onto the substrate to define the die attachment area. In this manner, the die attachment material is contained on the substrate. Thus, the method of the present invention improves the reliability of the electronic die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.