Heat pump type hot water supply apparatus
US6601773B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 14, 2002 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Mar 5, 2022 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF25B2309/061
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat pump type hot water supply apparatus (10) for heating water by refrigerant heat and stocking the hot water thus achieved including: a heat pump unit (11) having a refrigerant circuit using natural refrigerant, the refrigerant circuit including a compressor (16) for compressing refrigerant, a heat-pump heat exchanger (18) and a refrigerant-water heat exchanger (27) for performing the heat exchange between refrigerant and water to achieve hot water; a hot water supply unit (12) including a hot water supply tank (26) for stocking the hot water achieved by the refrigerant-water heat exchanger (27) of the heat pump unit (11) and supplying the hot water thus stocked; and a water pipe (36) through which the refrigerant-water heat exchanger (27) of the heat pump unit (11) and the hot water supply tank (26) of the hot water supply unit (12) are connected to each other to circulate hot-water/water between the refrigerant-water heat exchanger (27) and said hot water supply tank (26).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.