Methods for the control of contaminants following carbon dioxide cleaning of microelectronic structures
US6602351B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 13, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Sep 13, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of cleaning and removing water and entrained solutes during a manufacturing process from a microelectronic device such as a resist-coated semiconductor substrate, a MEM's device, or an optoelectronic device comprising the steps of: (a) providing a partially fabricated integrated circuit, MEM's device, or optoelectronic device having water, entrained solutes, and/or solid particles or the like on the substrate; (b) providing a densified (e.g., liquid or supercritical) carbon dioxide cleaning composition, the drying composition comprising carbon dioxide and, optionally but preferably, a cleaning adjunct; (c) immersing the surface portion in the densified carbon dioxide cleaning composition; and then (d) removing the cleaning composition from the surface portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.