Method for producing a tin-nickel alloy film
US6602354B2 · kind B2 · utility
6Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | May 23, 2021 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D5/12
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin layer and a nickel layer are stacked sequentially on a given substrate to form a multilayered film composed of the tin layer and the nickel layer. Then, the multilayered film is heated to a given temperature to form a tin-nickel alloy film through the diffusion of the tin elements of the tin layer into the nickel layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.