Chemical-mechanical planarization slurries and powders and methods for using same
US6602439B1 · kind B1 · utility
29Cited by
32References
42Claims
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Key dates
| Filing date | Feb 24, 1998 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Feb 24, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
Chemical-mechanical planarization slurries and methods for using the slurries wherein the slurry includes abrasive particles. The abrasive particles have a small particle size, narrow size distribution and a spherical morphology and the particles are substantially unagglomerated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.