Liquid crystalline polymer bond plies and circuits formed therefrom
US6602583B2 · kind B2 · utility
12Cited by
27References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A multi-layer circuit board comprises a liquid crystalline polymer bond ply disposed between two circuit layers wherein the liquid crystalline polymer bond ply is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/° C. and further wherein the multi-layer circuit is formed by lamination at a temperature of 0° C. to about 10° C. less than the melt temperature of the liquid crystalline polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.