Water-based solder resist composition
US6602651B1 · kind B1 · utility
2Cited by
9References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Jan 5, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/032
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides an aqueous solder resist composition comprising:(a) A water-soluble or water-dispersible, photopolymerizable resin containing at least one polymerizable unsaturated group and at least one carboxyl group, the carboxyl group being neutralized with an amine compound,(b) a photoinitiator,(c) an amino resin, and(d) a low reactivity epoxy compound free of an epoxy group represented by the formula  wherein Y is oxygen or nitrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.