Method for mounting a semiconductor chip on a substrate and semiconductor device adapted for mounting on a substrate
US6602732B2 · kind B2 · utility
25Cited by
5References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 11, 2002 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Apr 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/014
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a semiconductor device includes the steps of providing a semiconductor chip having a pad-mounting surface with a bonding pad, forming an inner bump on the bonding pad, and forming a conductive body on the pad-mounting surface. The conductive body has an anchor portion connecting electrically with and encapsulating the inner bump, and a contact portion offset from the anchor portion and adapted to be connected to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.