Method of manufacturing a semiconductor device
US6602734B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Oct 20, 2000 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Jul 26, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
For the manufacturing of semiconductor devices, in which multiple semiconductor chips which are mounted on a wiring substrate are processed for block molding and thereafter the wiring substrate is diced into individual resin-molded semiconductor devices, disclosed herein is a technique for easily determining the position of each resin-molded semiconductor device in its former state on the wiring substrate even after the dicing process. The processing steps include implementing the block molding with resin for multiple semiconductor chips mounted on a wiring substrate and thereafter dicing the wiring substrate into individual resin-molded semiconductor devices, with the substrate dicing step being preceded by a step of appending an address information pattern to each of the resin-molded semiconductor devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.