Ultraviolet/electron beam forming process for multi-layer electronic components and products thereof
US6602766B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Nov 27, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4664
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayered electronic component with or without inter-layer connections created by a process using radiation curing such as ultraviolet/electron beam curing techniques. UV light or electron beam curable binders are mixed with ceramic powders and metals powders to form a ceramic slurry and electrode ink, there is little or no solvent in the metal ink and ceramic slurry. Instead of drying, a UV or electron beam is used for curing the binders. These binders could contain UV/electron beam curable monomers or oligomers, photo initiators, and other additives to provide the desired chemical and physical properties in the forming process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.