Semiconductor device
US6603148B1 · kind B1 · utility
47Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 27, 2000 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Nov 27, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device (A) includes a first lead (4) to which a semiconductor chip (1) is bonded, a second lead (5) connected to the semiconductor chip (1) via a wire (W), and a resin package (2) sealing the semiconductor chip (1) and the wire (W). Of the first and the second leads (4, 5), at least one of inner terminals (4a, 5b) enclosed in the resin package (2) is bent in a direction of a thickness of the resin package (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.