Semiconductor package and method of manufacturing semiconductor package
US6603154B2 · kind B2 · utility
8Cited by
9References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 2001 |
| Grant date | Aug 5, 2003 |
| Priority date | — |
| Expiry date | Mar 23, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lower electrode of a semiconductor is directly connected to a heat sink, while a first electrode and a second electrode are connected to a plate-shaped second conductor by means of a first conductor. Radiated heat of the semiconductor is directly conducted to the heat sink and absorbed. The heat is radiated by being further conducted to the plate-shaped second conductor via the first conductor, thereby allowing the semiconductor to have a reduced temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.