Manufacturing method for a piezoelectric component
US6604266B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Dec 20, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49004
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a piezoelectric component in which a resonating portion on a piezoelectric substrate is provided with a deposit that is sensitive to radiation in a range of wavelengths from 350 to 2000 nm so as to have portions thereof trimmed away to form indentations therein without burning the deposit to avoid generating heat that is injurious to the piezoelectric component and substrate. A laser beam in the frequency range of 350 to 2000 nm is then caused to impinge on the deposit to cause the formation of trimmed indentations without substrate damaging heat in a controlled manner to adjust the resonance frequency of the piezoelectric component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.