Apparatus and method for fixing and checking connections of piezoelectric sensor, actuator, and disk unit
US6604431B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Jul 19, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/877
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
To provide a piezoelectric sensor that never sacrifices work properties such as when a lead wire is to be soldered to one of a pair of electrodes of a piezoelectric sensor, and the other electrode is to be bonded and fixed to a predetermined member with an adhesive, and to bond the ground electrode of the piezoelectric sensor to the conductive portion of the object member with an adhesive so as to be fixed and connected electrically, thereby preventing a short-circuit that might occur between the two electrodes due to extruded and stuck adhesive, and to provide an easier method for testing whether or not the ground electrode is connected electrically to the conductive portion of the object member. A piezoelectric sensor has two electrodes that are formed with different materials appropriate for soldering and bonding by an adhesive. The ground electrode of the piezoelectric sensor is bonded to the object member with a non-conductive adhesive so as to be connected electrically. Furthermore, the capacity between the output electrode of the piezoelectric sensor and the object member is measured to check the electrical connection between the ground electrode and the object member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.