Manifold for heat exchanger and process therefor
US6604669B1 · kind B1 · utility
12Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2001 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Dec 4, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49393
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Manifold for a heat exchanger intended to be joined by brazing or soldering to heat transfer tubes. A portion of a surface of the manifold that will be joined to the tubes is proved with at least one recess in which a brazing material is mechanically locked.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.