Polishing pad and method of producing the same
US6604990B2 · kind B2 · utility
3Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2001 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D11/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad for polishing glass and the like has a working layer with a plurality of polishing grains, an attaching layer with which the polishing pad is attachable to a polishing head of a power tool, and a connection layer which connects the working layer, with the attaching layer, and the connection layer is composed of vulcanizable material, which is vulcanized at certain temperature and under certain pressure and thereby connects the working layer with the attaching layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.