Method and apparatus for bonding optical disk substrate
US6605179B1 · kind B1 · utility
3Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 25, 1999 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Aug 25, 2019 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2429/02
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method and an apparatus for bonding optical disk substrates, includes placing a pair of optical disk substrates on a stage while securing a height difference at an upper face of the stage loading the substrates between an upper face at a side of a center of the substrates and an upper face at a side of an outer circumference of the substrates. The method and the apparatus also includes photosetting the adhesive layer on the stage by irradiating a setting light to the substrate pair, thereby photosetting the adhesive layer and bonding the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.