Electroplating of copper from alkanesulfonate electrolytes
US6605204B1 · kind B1 · utility
8Cited by
8References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 22, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Sep 22, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is an improved electrolyte formulation for the electrodeposition of copper onto electronic devices substrates and a process using the formulation. The formulation is a solution which contains copper alkanesulfonate salts and free alkanesulfonic acids and which is intended for the metallization of micron or sub-micron dimensioned trenches or vias.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.