Liquid crystal resin laminated film, method for manufacturing the same, and circuit board comprising liquid crystal resin laminated film
US6605324B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2001 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Jun 1, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are a liquid-crystalline resin laminated film comprising a liquid-crystalline resin layer and a non-liquid-crystalline thermoplastic resin layer laminated on at least one surface of the liquid-crystalline resin layer, and having an interlayer adhesiveness of at least 30 N/cm; and a liquid-crystalline resin laminated film comprising a liquid-crystalline resin layer and a non-liquid-crystalline thermoplastic resin layer laminated on at least one surface of the liquid-crystalline resin layer, and satisfying TN≧TL wherein TN and TL indicate the thermal deformation temperature of the non-liquid-crystalline thermoplastic resin layer and that of the liquid-crystalline resin layer, respectively, measured through thermal mechanical analysis (TMA). These are obtained by forming a non-liquid-crystalline thermoplastic resin layer on at least one surface of a liquid-crystalline resin layer through co-extrusion, followed by stretching the resulting laminated film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.