Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide
US6605353B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | May 11, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide an epoxy modified polyimide, which is a resin capable of treating at a low processing temperature and having an excellent heat resistance; photosensitive composition; coverlay film, which is excellent in electrical insulation property, heat resistance for soldering, film-formability, flexibility, and chemical resistance; solder resist; and printed wiring board. The epoxy modified polyimide is obtained by synthesizing polyimide having a hydroxy group or carboxy group and subsequently reacting the polyimide with an epoxy compound. The photosensitive composition is obtained by adding a photoreaction initiator or the like to the epoxy modified polyimide. The coverlay film and the solder resist can be formed from the photosensitive composition. The printed wiring board is produced using the coverlay film and the solder resist.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.