Polyamide resin composition and process for producing the same
US6605655B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Mar 29, 2020 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided is a polyamide resin composition comprising a melt blend of (A) a polyamide resin, (B) a phyllosilicate, and (C) an olefin compound having a carboxylic acid anhydride group in the molecule or a polymer of the olefin compound, in which the phyllosilicate (B) has a reactive functional group bonded thereto and is such that the exchangeable metal ions existing in the inter layers are ion-exchanged with organic onium ions. The composition has a reduced inorganic ash content and has both high stiffness and high ductility. Optionally, the composition contains an inorganic filler apart from the phyllosilicate, an impact modifier, and a flame retardant, still having high stiffness and high ductility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.