Patent · US Expired

Circuit carrier, in particular printed circuit board

US6605778B2 · kind B2 · utility

25Cited by

4References

15Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Helmut Dörfler · Erlangen, DE
Heiko Mueller · Heidelberg, DE
Sebastian Raith · Erlangen, DE

Key dates

Filing date	Oct 2, 2001
Grant date	Aug 12, 2003
Priority date	—
Expiry date	Oct 2, 2021

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10689
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A circuit carrier (2) (printed circuit board 2) has two metallic outer layers (13, 14) and at least one metallic intermediate layer (11, 12). Insulating layers (8, 9) are arranged between the outer layers (13, 14) and the intermediate layer (11, 12). A component (3, 5) to be cooled and a cooling element (6, 7) are arranged on the outer layers (13, 14). The cooling element (6, 7) is thermally coupled to the component (3, 5) to be cooled via a heat conducting path. The heat conducting path runs partly in the intermediate layer (11, 12). Heat is transferred transversely in said path.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.