Cutting of ultra-hard materials
US6605798B1 · kind B1 · utility
35Cited by
1References
11Claims
0Family size
Inventor
Key dates
| Filing date | Nov 12, 2001 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Nov 12, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides the use of a slab laser beam for the cutting of an ultra-hard material such as PCD or PCBN.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.