Thermal head and thermal head unit
US6606109B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Apr 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2/345
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A thermal head and a thermal head unit are provided, which can prevent density variation while suppressing the size of the thermal head to be small. In a thermal head (10) having a head chip (20) having one surface on which heat generating elements and segment and common electrodes connected to the heat generating elements are provided, and an IC chip (32) connected to the segment electrodes, the common electrode (27) provided to the head chip (20) is elongated in an array direction of the heat generating elements, and connections between the common electrode (27) and common electrode wirings (41) are provided at plural locations along the array direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.