Electrostatic chuck and method for forming an electrostatic chuck having porous regions for fluid flow
US6606234B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 5, 2000 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Apr 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6833
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic chuck includes a chuck body having a chucking surface and a back surface, an electrode within the chuck body and at least one conduit for providing fluid communication between the back surface and a chucking surface. The conduit includes a porous region which is integrated with the chuck body. During operation, the temperature of a wafer supported by the electrostatic chuck can be controlled or modified by directing a heat transfer fluid, through the porous region, to the chucking surface. The porous region prevents or minimizes plasma penetration and arcing problems. Also described are methods of fabricating an electrostatic chuck having a porous region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.