Method of manufacturing system LSI and system LSI manufactured using the method
US6606532B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 7, 1999 |
| Grant date | Aug 12, 2003 |
| Priority date | — |
| Expiry date | Dec 7, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/30
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a system LSI is disclosed, in which the running cost such the power consumption is not increased even in the case where the hardware, and software are reused for reducing the manufacturing cost. The method for manufacturing a system LSI, having at least a processor and a memory in a single chip, comprises the steps of preparing a system LSI in the stage where a preset common process has been complete, determining the working area for activating an application program mounted on the system LSI based on the datapath width of the processor and the word length and the number of words of the memory used for activating the application program, and completing the manufacture of the system LSI in such a manner that no power is supplied to the area other than the working area. In this way, the hardware and software are reused without increasing the power consumption or other running costs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.