Apparatus and method for removing a soldered device from a printed circuit board
US6607113B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Nov 14, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S269/903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A rework nozzle includes a gripping device that is used to remove a soldered device from a circuit board. The rework nozzle attaches to a module that generates hot gas. The device that is to be removed from the circuit board is placed within the nozzle. The module generates hot gas, and the hot gas is directed by the nozzle to soldered connections that couple the device to the circuit board. The hot gas melts the solder and the gripping mechanism is used to grasp the device. The device may be removed from the circuit board by separating the circuit board from the nozzle after the hot gas melts the solder. The nozzle will release the device if the force needed to remove the device is greater than the force applied to the device by the gripping mechanism. The release of the device will prevent damage to the device or to the circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.