Method and apparatus for estimating quality of lead-free solder material and process and system for flow soldering
US6607116B2 · kind B2 · utility
0Cited by
6References
19Claims
0Family size
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Key dates
| Filing date | Jun 6, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Jun 6, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided a method which can conveniently estimate a quality of a lead-free solder material used for a flow soldering process. In the present invention, a differential thermal analysis curve of a sample of the lead-free solder material is obtained by utilizing a differential thermal analysis method, and thereby a quality of the lead-free solder material used for a flow soldering process is estimated based on the obtained differential thermal analysis curve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.