Module for IC card, IC card, and method for manufacturing module for IC card
US6607135B1 · kind B1 · utility
64Cited by
11References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 22, 1999 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Feb 22, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01037
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An IC-card module (A) to be incorporated in an IC-card (B) includes a substrate (1), an IC chip (2) mounted on the substrate, and a protective member (4) bonded to the substrate (1) to cover the IC chip (2). A clearance (S) is provided between the protective member (4) and the IC chip (2) for avoiding direct contact of the protective member (4) with the IC chip (2). The clearance (S) is loaded with a filler (6) having a low modulus of elasticity, as required. The protective member (4) includes a reinforcing member (8).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.