Polishing composition and method
US6607571B2 · kind B2 · utility
5Cited by
14References
10Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Aug 21, 2002 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Aug 21, 2022 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09K3/1463
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
To provide a polishing composition which enables maintenance of excellent properties and high quality of the surface of a hard disk without lowering polishing rate during polishing of the surface, and which can provide a polished surface in which the amount of dub-off is considerably reduced as compared with that of a conventional level, a polishing composition containing water, a polishing material (particularly alumina), a polishing accelerator, and at least one of hydroxypropyl cellulose and hydroxyalkyl alkyl cellulose is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.