Metal film bonded body, bonding agent layer and bonding agent
US6607825B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 1997 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Aug 22, 2017 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/64
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
As a technique capable of stably providing various metal film adhered bodies for printed circuit boards having an excellent peel strength even in the wiring having higher density and higher pattern accuracy and other industrial parts, there are provided adhesive, adhesive layer and metal film adhered body in which a mixed resin consisting of a thermoplastic resin and an uncured thermosetting resin including a resin substituted at a part of its functional group with a photosensitive group and/or an uncured photosensitive resin is used as a heat-resistant resin matrix constituting the adhesive and further a cured homogeneous resin composite forming a quasi-homogeneous compatible structure, co-continuous phase structure or spherical domain structure is used as a heat-resistant resin matrix of the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.