Positive photosensitive resin composition
US6607865B2 · kind B2 · utility
6Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2002 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Feb 1, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/0233
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity. That is, the present invention provides a positive photosensitive resin composition comprising 100 parts by weight of a polyamide resin and 1 to 50 parts by weight of a photosensitizer represented by, for example, the following formula (Q-1):
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.