Apparatus and method for solder-sealing an active matrix organic light emitting diode
US6608283B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 8, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Jan 25, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/30
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention is directed to an apparatus and method of solder-sealing an active matrix OLED display using a monochromatic solid-state laser beam (1). The solder-sealing apparatus comprises a cover assembly (13) adapted to be positioned over at least one OLED (11) on a substrate (10), a sealing band (12) surrounding each OLED, a chuck assembly (20) with an array of heat sinks (21) that align with the OLEDs, a pick-up assembly (30) with at least one aperture (33), and a flange assembly (132) to which a solder pre-form (133) is secured. The chuck assembly (20) receives, aligns and orients the substrate (10). A vacuum is then applied through each aperture (33) to align and hold the cover assembly (13) in place. The sealing band (12) and solder pre-form (133) are aligned and pressed together by the pick-up assembly (30), and the focused laser beam (1) is projected through the chuck assembly to seal the OLEDs (11) within the cover assembly (13).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.