Grounded fill in a large scale integrated circuit
US6608335B2 · kind B2 · utility
8Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 25, 2000 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | May 25, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit has a plurality of metal layers separated by a plurality of insulating layers. The integrated circuit comprises a pair of conductors on a first metal layer; at least one conductive fill element disposed between the conductors; and a via connecting the fill element to a ground contact on a metal layer adjacent to said first metal layer, where the via is formed of a conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.