Semiconductor apparatus with decoupling capacitor
US6608375B2 · kind B2 · utility
39Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 6, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Apr 6, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/183
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A lead frame type of semiconductor apparatus includes a die pad on which a semiconductor chip is mounted; ground terminals which are to be grounded; power supply terminals which are connected to a power supply; inner leads connected to the ground terminals and power supply terminals, in which a pair of adjacent inner leads for power supply terminal and ground terminal are extended inwardly; a chip capacitor mounting pad which is provided at inner ends of the extended inner leads; and a chip capacitor which is mounted on the chip capacitor mounting pad so that a decoupling capacitor is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.