Adaptive heat sink for electronics applications
US6608752B2 · kind B2 · utility
16Cited by
17References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 24, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Sep 24, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink for a compact, integral lamp system comprises a bimetal strip or a bimetal heat pipe containing a liquid. With temperature change, the bimetal strip or pipe flexes toward one metal or the other, depending on the physical properties of the particular metals. The deformation of the strip causes heat sink fins to press against the surface of the ballast wall, thereby significantly reducing or eliminating the air gaps therebetween and thus more effectively removing heat from the ballast.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.