Dielectric material including particulate filler
US6608760B2 · kind B2 · utility
11Cited by
52References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 9, 1999 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Dec 9, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09309
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric substrate useful in the manufacture of printed wiring boards is disclosed wherein the dielectric substrate comprises at least one organic polymer having a Tg greater than 140° C. and at least one filler material. The dielectric substrate of this invention has a dielectric constant that varies less than 15% over a temperature range of from −55 to 125° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.