Telecommunications patch panel
US6608764B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2001 |
| Grant date | Aug 19, 2003 |
| Priority date | — |
| Expiry date | Nov 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04Q2201/12
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A telecommunications module with a circuit board including pairs of connectors mounting on both sides of the circuit board held within a housing by structure that holds the circuit board offset from the front and rear of the module and connectors accessible openings in the rear wall of the module. A telecommunications patch panel including one or more modules mounted to the rear of a faceplate, each module with a circuit board including pairs of electrically linked connectors mounting on both sides of the circuit board held within the module by structure that holds the circuit board offset from the front and rear of the module with connectors accessible through a rear wall of the module and through the faceplate. A method of assembling a telecommunications module and a method of assembling a telecommunications patch panel including one or more modules attached to the rear of a faceplate. A circuit board for mounting pairs of telecommunications connectors on opposite sides, the circuit board including circuits connecting the mounting locations, each circuit paired with and laid adjacent to another circuit and all the circuits positioned on a single layer of the circuit board without…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.