Copper electroplating
US6610192B1 · kind B1 · utility
41Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2001 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Nov 2, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed are compositions and methods for providing a planarized metal layer on a substrate having small apertures. The compositions and methods of the present invention provide complete fill of small apertures with reduced void formation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.