Enhanced defect detection using surface scanning inspection tools
US6611325B1 · kind B1 · utility
1Cited by
9References
27Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 15, 2000 |
| Grant date | Aug 26, 2003 |
| Priority date | — |
| Expiry date | Mar 15, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N21/9501
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A surface scanning inspection system that uses a laser to scan the surface of a wafer for defects. The wafers are pre-aligned at a specified angle prior to the scan. This enables maximum light scattered off stacking fault defects, to be directed into a collector, enhancing the abilities of the system to classify the defect from other type of defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.