Cutting method for hard, brittle materials
US6612300B2 · kind B2 · utility
3Cited by
4References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 7, 2002 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Aug 7, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D5/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a cutting method for hard, brittle materials that is capable of completely cutting through hard, brittle materials such as ceramic, glass, concrete, stone and single crystal materials without the occurrence of edge chipping and at high speed.The present invention is characterized by being a method for completely cutting through a hard, brittle material 1 using a disk-shaped rotary grindstone 2, wherein the cross-sectional shape of the outer peripheral edge 20 of rotary grindstone 2 has a V-shaped pointed shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.