Apparatus and method for joining layers of materials
US6612479B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Nov 19, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and apparatus for joining multiple layers of materials using an ultrasonic welding apparatus. The ultrasonic welding apparatus utilizes a sonotrode to perform a weld between at least the top and intermediate layer of the multi-layer member. Then, either the multi-layer member or the ultrasonic welding apparatus is rotated such that the bottom layer is positioned adjacent the sonotrode wherein the sonotrode forms a weld between at least the bottom layer and intermediate layer of the multi-layer member. The apparatus includes an ultrasonic welding gun having a C-shape frame including a base portion and a head portion. An ultrasonic welding device, including a sonotrode, is secured to the head portion and an anvil secured to the base portion. The ultrasonic welding gun is connected to a robot operative to position the ultrasonic welding gun to perform the welding operation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.