Method for making an electrical circuit board
US6613239B2 · kind B2 · utility
0Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Oct 27, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.