Metal/ceramic bonding article
US6613450B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2002 |
| Grant date | Sep 2, 2003 |
| Priority date | — |
| Expiry date | Mar 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/1259
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
There is provided a metal/ceramic bonding article which ensures sufficient thermal shock resistance and has a substrate having a small outside dimension and which has both high reliability and compactness. The metal/ceramic bonding article comprises: a ceramic substrate; and a metal plate bonded to the ceramic substrate via a brazing filler metal, wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is longer than 30 &mgr;m and which is 250 &mgr;m or less, or wherein the brazing filler metal protrudes from the bottom face of the metal plate by a length which is 25% or more of the thickness of the metal plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.